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No Bond - Part Scholarship

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dennis Male
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Join Date: Jul 2010
Posts: 1
  #1 Old 13-07-2010 Default No Bond - Part Scholarship

SAE Institute, the world's largest creative media educator, announced the launch of the Part Scholarship initiative, providing up to maximum 50 per cent subsidy for the first 12 months of course fees at SAE Institute located in Singapore.

The part-scholarships below are offered on a competitive basis. Applicants must have good academic or professional records. There is no bond or obligation for the applicants who are awarded with the partial scholarships.

This unique part-scholarship value will be based on 25% to 50% of the course fees for the following 1 year full time course for the October 2010 intake in Singapore

- Diploma of Screen (Animation)
- Diploma of IT (Games Programming)
- Bachelor of Arts (Hons) Interactive Animation
- Bachelor of Arts (Hons) Games Programming

Applicants can visit the website at:
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diploma, scholarship, singapore

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